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To continue reducing voltage in scaled technologies, both circuit and architecture-level resiliency techniques are needed to tolerate process-induced defects, variation, and aging in SRAM cells. Many different resiliency schemes have been proposed and evaluated, but most prior results focus on voltage reduction instead of energy reduction. At the circuit level, device cell architectures and assist techniques have been shown to lower Vmin for SRAM, while at the architecture level, redundancy and cache disable techniques have been used to improve resiliency at low voltages. This paper presents a unified study of error tolerance for both circuit and architecture techniques and estimates their area and energy overheads. Optimal techniques are selected by evaluating both the error-correcting abilities at low supplies and the overheads of each technique in a 28nm. The results can be applied to many of the emerging memory technologies.