Refine
Document Type
- Article (5)
Language
- English (5) (remove)
Has Fulltext
- yes (5)
Faculty / Organisational entity
Using molecular dynamics simulation, we study the cutting of an Fe single crystal using
tools with various rake angles α. We focus on the (110)[001] cut system, since here, the crystal
plasticity is governed by a simple mechanism for not too strongly negative rake angles. In this
case, the evolution of the chip is driven by the generation of edge dislocations with the Burgers
vector b = 1
2
[111], such that a fixed shear angle of φ = 54.7◦
is established. It is independent of
the rake angle of the tool. The chip form is rectangular, and the chip thickness agrees with the
theoretical result calculated for this shear angle from the law of mass conservation. We find that the
force angle χ between the direction of the force and the cutting direction is independent of the rake
angle; however, it does not obey the predictions of macroscopic cutting theories, nor the correlations
observed in experiments of (polycrystalline) cutting of mild steel. Only for (strongly) negative rake
angles, the mechanism of plasticity changes, leading to a complex chip shape or even suppressing the
formation of a chip. In these cases, the force angle strongly increases while the friction angle tends
to zero.
Cyclic indentation is a technique used to characterize materials by indenting repeatedly on the same location. This technique allows information to be obtained on how the plastic material response changes under repeated loading. We explore the processes underlying this technique using a combined experimental and simulative approach. We focus on the loading–unloading hysteresis and the dependence of the hysteresis width ha,p on the cycle number. In both approaches, we obtain a power-law demonstrating ha,p with respect to the hardening exponent e. A detailed analysis of the atomistic simulation results shows that changes in the dislocation network under repeated indentation are responsible for this behavior.
Indentation into a metastable austenite may induce the phase transformation to the bcc phase. We study this process using
atomistic simulation. At temperatures low compared to the equilibrium transformation temperature, the indentation triggers the
transformation of the entire crystallite: after starting the transformation, it rapidly proceeds throughout the simulation crystallite.
The microstructure of the transformed sample is characterized by twinned grains. At higher temperatures, around the equilibrium
transformation temperature, the crystal transforms only locally, in the vicinity of the indent pit. In addition, the indenter
produces dislocation plasticity in the remaining austenite. At intermediate temperatures, the crystal continuously transforms
throughout the indentation process.
Indentation and Scratching with a Rotating Adhesive Tool: A Molecular Dynamics Simulation Study
(2022)
For the specific case of a spherical diamond nanoparticle with 10 nm radius rolling over a planar Fe surface, we employ molecular dynamics simulation to study the processes of indentation and scratching. The particle is rotating (rolling). We focus on the influence of the adhesion force between the nanoparticle and the surface on the damage mechanisms on the surface; the adhesion is modeled by a pair potential with arbitrarily prescribed value of the adhesion strength. With increasing adhesion, the following effects are observed. The load needed for indentation decreases and so does the effective material hardness; this effect is considerably more pronounced than for a non-rotating particle. During scratching, the tangential force, and hence the friction coefficient, increase. The torque needed to keep the particle rolling adds to the total work for scratching; however, for a particle rolling without slip on the surface the total work is minimum. In this sense, a rolling particle induces the most efficient scratching process. For both indentation and scratching, the length of the dislocation network generated in the substrate reduces. After leaving the surface, the particle is (partially) covered with substrate atoms and the scratch groove is roughened. We demonstrate that these effects are based on substrate atom transport under the rotating particle from the front towards the rear; this transport already occurs for a repulsive particle but is severely intensified by adhesion.
Using the molecular dynamics simulation, we study the cutting of Al/Si bilayer systems. While the plasticity of metals is dominated by dislocation activity, the deformation behavior of Si crystals is governed by phase transformations—here to the amorphous phase. We find that twinning adds as a major deformation mechanism in the cutting of Al crystals. Cutting of Si crystals requires thrust forces that are larger than the cutting forces in order to induce amorphization; in metals, the thrust forces are relatively smaller than the cutting forces. When putting an Al top layer on a Si substrate, the thrust force is reduced; the opposite effect is observed if a Si top layer is put on an Al substrate. Covering an Al substrate with a thin Si top layer has the detrimental effect that the hard Si requires high pressures for cutting; as a consequence, twinning planes with intersecting directions are generated that ultimately lead to cracks in the ductile Al substrate. The crystallinity of the Si chip is strongly changed if an Al substrate is put under the Si top layer: With decreasing thickness of the Si top layer, the Si chip retains a higher degree of crystallinity.