Thermal Modeling and Management of Multi-Core Processors

  • The work presented in this thesis discusses the thermal and power management of multi-core processors (MCPs) with both two dimensional (2D) package and there dimensional (3D) package chips. The power and thermal management/balancing is of increasing concern and is a technological challenge to the MCP development and will be a main performance bottleneck for the development of MCPs. This thesis develops optimal thermal and power management policies for MCPs. The system thermal behavior for both 2D package and 3D package chips is analyzed and mathematical models are developed. Thereafter, the optimal thermal and power management methods are introduced. Nowadays, the chips are generally packed in 2D technique, which means that there is only one layer of dies in the chip. The chip thermal behavior can be described by a 3D heat conduction partial differential equation (PDE). As the target is to balance the thermal behavior and power consumption among the cores, a group of one dimensional (1D) PDEs, which is derived from the developed 3D PDE heat conduction equation, is proposed to describe the thermal behavior of each core. Therefore, the thermal behavior of the MCP is described by a group of 1D PDEs. An optimal controller is designed to manage the power consumption and balance the temperature among the cores based on the proposed 1D model. 3D package is an advanced package technology, which contains at least 2 layers of dies stacked in one chip. Different from 2D package, the cooling system should be installed among the layers to reduce the internal temperature of the chip. In this thesis, the micro-channel liquid cooling system is considered, and the heat transfer character of the micro-channel is analyzed and modeled as an ordinary differential equation (ODE). The dies are discretized to blocks based on the chip layout with each block modeled as a thermal resistance and capacitance (R-C) circuit. Thereafter, the micro-channels are discretized. The thermal behavior of the whole system is modeled as an ODE system. The micro-channel liquid velocity is set according to the workload and the temperature of the dies. Under each velocity, the system can be described as a linear ODE model system and the whole system is a switched linear system. An H-infinity observer is designed to estimate the states. The model predictive control (MPC) method is employed to design the thermal and power management/balancing controller for each submodel. The models and controllers developed in this thesis are verified by simulation experiments via MATLAB. The IBM cell 8 cores processor and water micro-channel cooling system developed by IBM Research in collaboration with EPFL and ETHZ are employed as the experiment objects.

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Verfasserangaben:Jianfei Wang
URN (Permalink):urn:nbn:de:hbz:386-kluedo-36822
Betreuer:Steven Liu
Sprache der Veröffentlichung:Englisch
Veröffentlichungsdatum (online):13.01.2014
Jahr der Veröffentlichung:2014
Veröffentlichende Institution:Technische Universität Kaiserslautern
Titel verleihende Institution:Technische Universität Kaiserslautern
Datum der Annahme der Abschlussarbeit:23.08.2013
Datum der Publikation (Server):13.01.2014
Seitenzahl:VII, 139
Fachbereiche / Organisatorische Einheiten:Fachbereich Elektrotechnik und Informationstechnik
DDC-Sachgruppen:6 Technik, Medizin, angewandte Wissenschaften / 621.3 Elektrontechnik, Elektronik
Lizenz (Deutsch):Standard gemäß KLUEDO-Leitlinien vom 10.09.2012