Kaiserslautern - Fachbereich Elektrotechnik und Informationstechnik
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3D integration of solid-state memories and logic, as demonstrated by the Hybrid Memory Cube (HMC), offers major opportunities for revisiting near-memory computation and gives new hope to mitigate the power and performance losses caused by the “memory wall”. In this paper we present the first exploration steps towards design of the Smart Memory Cube (SMC), a new Processor-in-Memory (PIM) architecture that enhances the capabilities of the logic-base (LoB) in HMC. An accurate simulation environment has been developed, along with a full featured software stack. All offloading and dynamic overheads caused by the operating system, cache coherence, and memory management are considered, as well. Benchmarking results demonstrate up to 2X performance improvement in comparison with the host SoC, and around 1.5X against a similar host-side accelerator. Moreover, by scaling down the voltage and frequency of PIM’s processor it is possible to reduce energy by around 70% and 55% in comparison with the host and the accelerator, respectively.
A counter-based read circuit tolerant to process variation for low-voltage operating STT-MRAM
(2016)
The capacity of embedded memory on LSIs has kept increasing. It is important to reduce the leakage power of embedded memory for low-power LSIs. In fact, the ITRS predicts that the leakage power in embedded memory will account for 40% of all power consumption by 2024 [1]. A spin transfer torque magneto-resistance random access memory (STT-MRAM) is promising for use as non-volatile memory to reduce the leakage power. It is useful because it can function at low voltages and has a lifetime of over 1016 write cycles [2]. In addition, the STT-MRAM technology has a smaller bit cell than an SRAM. Making the STT-MRAM is suitable for use in high-density products [3–7]. The STT-MRAM uses magnetic tunnel junction (MTJ). The MTJ has two states: a parallel state and an anti-parallel state. These states mean that the magnetization direction of the MTJ’s layers are the same or different. The directions pair determines the MTJ’s magneto- resistance value. The states of MTJ can be changed by the current flowing. The MTJ resistance becomes low in the parallel state and high in the anti-parallel state. The MTJ potentially operates at less than 0.4 V [8]. In other hands, it is difficult to design peripheral circuitry for an STT-MRAM array at such a low voltage. In this paper, we propose a counter-based read circuit that functions at 0.4 V, which is tolerant of process variation and temperature fluctuation.
The authors explore the intrinsic trade-off in a DRAM between the power consumption (due to refresh) and the reliability. Their unique measurement platform allows tailoring to the design constraints depending on whether power consumption, performance or reliability has the highest design priority. Furthermore, the authors show how this measurement platform can be used for reverse engineering the internal structure of DRAMs and how this knowledge can be used to improve DRAM’s reliability.
This study presents an energy-efficient ultra-low voltage standard-cell based memory in 28nm FD-SOI. The storage element (standard-cell latch) is replaced with a full- custom designed latch with 50 % less area. Error-free operation is demonstrated down to 450mV @ 9MHz. By utilizing body bias (BB) @ VDD = 0.5 V performance spans from 20 MHz @ BB=0V to 110MHz @ BB=1V.
The energy efficiency of today’s microcontrollers is supported by the extensive usage of low-power mechanisms. A full power-down requires in many cases a complex, and maybe error prone, administration scheme, because data from the volatile memory have to be stored in a flash based back- up memory. New types of non-volatile memory, e.g. in RRAM technology, are faster and consumes a fraction of the energy compared to flash technology. This paper evaluates power gating for WSN with RRAM as back-up memory.
Three-dimensional (3D) integration using through- silicon via (TSV) has been used for memory designs. Content addressable memory (CAM) is an important component in digital systems. In this paper, we propose an evaluation tool for 3D CAMs, which can aid the designer to explore the delay and power of various partitioning strategies. Delay, power, and energy models of 3D CAM with respect to different architectures are built as well.
To continue reducing voltage in scaled technologies, both circuit and architecture-level resiliency techniques are needed to tolerate process-induced defects, variation, and aging in SRAM cells. Many different resiliency schemes have been proposed and evaluated, but most prior results focus on voltage reduction instead of energy reduction. At the circuit level, device cell architectures and assist techniques have been shown to lower Vmin for SRAM, while at the architecture level, redundancy and cache disable techniques have been used to improve resiliency at low voltages. This paper presents a unified study of error tolerance for both circuit and architecture techniques and estimates their area and energy overheads. Optimal techniques are selected by evaluating both the error-correcting abilities at low supplies and the overheads of each technique in a 28nm. The results can be applied to many of the emerging memory technologies.
Users privacy is more and more relevant in today digital world. In this paper, we study how mobile network operators (MNOs) practices can lead to loss of privacy for mobile phone subscribers. This article focuses on the mobile phone service providers' implication in privacy violation. Network attacks from other agents, such as cyber-criminals, are not covered in this work.
We review the impact of the location tracking improvement from 2G to 5G networks on police investigations and users' privacy rights.
We also study the role of MNOs in users' sensitive data monetization and the legality behind this practice.
There are few existing publications aiming to enhance mobile phone users' privacy protection against mobile broadband internet providers. We have tried to list all of them in this article.
Multiple-channel die-stacked DRAMs have been used for maximizing the performance and minimizing the power of memory access in 2.5D/3D system chips. Stacked DRAM dies can be used as a cache for the processor die in 2.5D/3D system chips. Typically, modern processor system-on-chips (SOCs) have three-level caches, L1, L2, and L3. Could the DRAM cache be used to replace which level of caches? In this paper, we derive an inequality which can aid the designer to check if the designed DRAM cache can provide better performance than the L3 cache. Also, design considerations of DRAM caches for meet the inequality are discussed. We find that a dilemma of the DRAM cache access time and associativity exists for providing better performance than the L3 cache. Organizing multiple channels into a DRAM cache is proposed to cope with the dilemma.
Autonomous driving is disrupting the conventional automotive development. In fact, autonomous driving kicks off the consolidation of control units, i.e. the transition from distributed Electronic Control Units (ECUs) to centralized domain controllers. Platforms like Audi’s zFAS demonstrate this very clearly, where GPUs, Custom SoCs, Microcontrollers, and FPGAs are integrated on a single domain controller in order to perform sensor fusion, processing and decision making on a single Printed Circuit Board (PCB). The communication between these heterogeneous components and the algorithms for Advanced Driving Assistant Systems (ADAS) itself requires a huge amount of memory bandwidth, which will bring the Memory Wall from High Performance Computing (HPC) and data-centers directly in our cars. In this paper we highlight the roles and issues of Dynamic Random Access Memories (DRAMs) for future autonomous driving architectures.