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Architecture Evaluation Tool for 3D CAMs

  • Three-dimensional (3D) integration using through- silicon via (TSV) has been used for memory designs. Content addressable memory (CAM) is an important component in digital systems. In this paper, we propose an evaluation tool for 3D CAMs, which can aid the designer to explore the delay and power of various partitioning strategies. Delay, power, and energy models of 3D CAM with respect to different architectures are built as well.

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Author:Yong-Xiao Chen, Jin-Fu Li
Document Type:Conference Proceeding
Language of publication:English
Publication Date:2016/03/18
Year of Publication:2016
Publishing Institute:Technische Universität Kaiserslautern
Date of the Publication (Server):2016/03/14
Number of page:2
Faculties / Organisational entities:Fachbereich Elektrotechnik und Informationstechnik
CCS-Classification (computer science):B. Hardware / B.3 MEMORY STRUCTURES / B.3.2 Design Styles (D.4.2) / Associative memories
DDC-Cassification:6 Technik, Medizin, angewandte Wissenschaften / 621.3 Elektrotechnik, Elektronik
Collections:International Workshop on Emerging Memory Solutions
Licence (German):Standard gemäß KLUEDO-Leitlinien vom 30.07.2015